Intel 450 BX80538450 Data Sheet
Product codes
BX80538450
36
Intel
®
Celeron
®
M Processor Datasheet
Package Mechanical Specifications and Pin Information
Table 15. Micro-FCBGA Package Dimensions
NOTE: Overall height as delivered. Values are based on design specifications and tolerances. This dimension
is subject to change based on OEM motherboard design or OEM SMT process.
Symbol Parameter
Min
Max
Unit
A
Overall height, as delivered (Refer to Note 1)
2.60
2.85
mm
A2 Die
height
0.82
mm
b Ball
diameter
0.78 mm
D Package
substrate
length
34.9
35.1
mm
E Package
substrate
width
34.9
35.1
mm
D1
Die length
10.56
mm
E1 Die
width
7.84
mm
F
To Package Substrate Center
17.5
mm
G
Die Offset from Package Center
1.133
mm
e Ball
pitch
1.27 mm
K Package
edge
keep-out
5
mm
K1 Package
corner
keep-out
7
mm
K2 Die-side
capacitor
height
- 0.7 mm
S
Package edge to first ball center
1.625
mm
N Ball
count
479 each
- Solder
ball
coplanarity
0.2 mm
Pdie
Allowable pressure on the die for thermal solution
-
689
kPa
W Package
weight
4.5
g