Eaton IPV3742-3883 Catalog

eaton.com/epdu 1.800.356.5794

Eaton's HCS is a simple, scalable and low cost rack-based solution 
to cool up to 25 kW or more per enclosure without the expense of 
adding supplemental CRAC units to your data center. This patented 
technology is available on Eaton’s Paramount and Vantage S2 
enclosure systems and can also be field retrofitted to most 
manufacturers' enclosures. The HCS contains and directs the heat 
exhaust of your IT equipment through the chimney that is attached 
to the top rear of the enclosure. The hot air is then ducted to your 
existing CRAC units through a plenum ceiling or high air returns.

Photo courtesy of Humana

Eaton’s HCS pressure based system with active airflow, when 
combined with best practices, improves performance metrics 
considerably. Allocating the correct amount of airflow at known 
intake locations is the key to reducing energy consumption 
while increasing equipment performance. Best practices such 
as blanking panels, proper perforated tile placement and the 
reduction of bypass airflow must be employed to ensure desired 
results.

Convert existing enclosures to the HCS to eliminate the 
incremental capital expense associated with having to add more 
CRAC units or other supplemental cooling.

Visit powerquality.eaton.com to view Eaton’s entire portfolio 

of racks, enclosures and airflow management solutions