Supermicro Xeon P4X4-028-512K User Manual
Product codes
P4X4-028-512K
Intel® Xeon™ Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
69
5.0
Thermal Specifications
This chapter provides the thermal specifications necessary for designing a thermal solution for the
Intel
Intel
®
Xeon™ Processor with 533 MHz Front Side Bus. Thermal solutions should include
heatsinks that attach to the integrated heat spreader (IHS). The IHS provides a common interface
intended to be compatible with many heatsink designs. Thermal specifications are based on the
temperature of the IHS top, referred to as the case temperature, or T
temperature of the IHS top, referred to as the case temperature, or T
CASE
. Thermal solutions should
be designed to maintain the processor within T
CASE
specifications. For information on performing
T
CASE
measurements, refer to the Intel® Xeon™ Processor Thermal Design Guidelines. See
for an exploded view of the processor package and thermal solution assembly.
Note:
The processor is either shipped alone or with a heatsink (boxed processor only). All other
components shown in
must be purchased separately.
Note:
This is a graphical representation. For specifications, see each component’s respective
.
Figure 18. Processor with Thermal and Mechanical Components - Exploded View
604 P in