Supermicro Xeon P4X4-028-512K User Manual

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The Intel® Xeon™ Processor with 533 MHz Front Side Bus is also offered as an Intel boxed

processor. Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The boxed processor is supplied with an

unattached passive heatsink. It will also contain an optional active duct solution, called Processor

Wind Tunnel (PWT), to provide adequate airflow across the heatsink. If the chassis or baseboard
used contains an alternate cooling solution that has been thermally validated, the PWT may be

discarded. This chapter documents baseboard and platform requirements for the cooling solution

that is supplied with the boxed processor. This chapter is particularly important for OEM's that
manufacture baseboards and chassis for integrators. 

 shows a mechanical representation

of a boxed processor heatsink.

Drawings in this section reflect only the specifications on the Intel boxed processor product. These

dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designer's responsibility to consider their proprietary cooling solution when designing to the

required keep-out zone on their system platform and chassis.