NEC Intel Xeon E5-2420 N8101-571F User Manual

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

167

Datasheet Volume One

1.

For functional operation, all processor electrical, signal quality, mechanical, and thermal specifications must 

be satisfied.

2.

Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined in 

. Excessive overshoot or undershoot on any signal will likely result in permanent damage to 

the processor.

Environmental storage condition limits define the temperature and relative humidity 
limits to which the device is exposed to while being stored in a Moisture Barrier Bag. 

The specified storage conditions are for component level prior to board attach (see 

notes in 

 for post board attach limits).

 specifies absolute maximum and minimum storage temperature limits which 

represent the maximum or minimum device condition beyond which damage, latent or 

otherwise, may occur. The table also specifies sustained storage temperature, relative 
humidity, and time-duration limits. These limits specify the maximum or minimum 

device storage conditions for a sustained period of time. At conditions outside sustained 

limits, but within absolute maximum and minimum ratings, quality & reliability may be 
affected. 

1.

Storage conditions are applicable to storage environments only. In this scenario, the processor must not 

receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect 

the long-term reliability of the device. For functional operation, please refer to the processor case 

temperature specifications.

2.

These ratings apply to the Intel component and do not include the tray or packaging.

3.

Failure to adhere to this specification can affect the long-term reliability of the processor.

4.

Non-operating storage limits post board attach: Storage condition limits for the component once attached 

to the application board are not specified. Intel does not conduct component level certification assessments 

post board attach given the multitude of attach methods, socket types and board types used by customers. 

Provided as general guidance only, Intel board products are specified and certified to meet the following 

temperature and humidity limits (Non-Operating Temperature Limit: -40°C to 70°C & Humidity: 50% to 

90%, non condensing with a maximum wet bulb of 28°C).

5.

Device storage temperature qualification methods follow JEDEC High and Low Temperature Storage Life 

Standards: JESD22-A119 (low temperature) and JESD22-A103 (high temperature).

T

absolute storage

The minimum/maximum device storage temperature 

beyond which damage (latent or otherwise) may 

occur when subjected to for any length of time.

-25

125

°C

T

sustained storage

The minimum/maximum device storage temperature 

for a sustained period of time.

-5

40

°C

T

short term storage

The ambient storage temperature (in shipping media) 

for a short period of time.

-20

85

°C

RH

sustained storage

The maximum device storage relative humidity for a 

sustained period of time.

60% @ 24

°C

Time

sustained storage

A prolonged or extended period of time; typically 

associated with sustained storage conditions 

Unopened bag, includes 6 months storage time by 

customer.

0

30

months

Time

short term storage

A short period of time (in shipping media).

0

72

hours