NEC Intel Xeon E5-2420 N8101-571F User Manual

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

241

Datasheet Volume One

The processor may contain components on the substrate that define component 
keep-out zone requirements. A thermal and mechanical solution design must not 

intrude into the required keep-out zones. Do not contact the Test Pad Area with 
conductive material. Decoupling capacitors are typically mounted to either the topside 

or land-side of the package substrate. See 

 for keep-out 

zones. The location and quantity of package capacitors may change due to 
manufacturing efficiencies but will remain within the component keep-in.

provides load specifications for the processor package. These maximum 

limits should not be exceeded during heatsink assembly, shipping conditions, or 

standard use condition. Exceeding these limits during test may result in component 

failure. The processor substrate should not be used as a mechanical reference or load-
bearing surface for thermal solutions.

.

1.

These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2.

This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism 

(ILM). 

3.

These specifications are based on limited testing for design characterization. Loading limits are for the 

package constrained by the limits of the processor socket. 

4.

Dynamic loading is defined as an 11 ms duration average load superimposed on the static load 

requirement.

5.

See Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design 

 for minimum socket load to engage processor within socket.

 includes a list of guidelines on package handling in terms of recommended 

maximum loading on the processor IHS relative to a fixed substrate. These package 

handling loads may be experienced during heatsink removal.

The processor can be inserted into and removed from an LGA2011-0 land FCLGA10 

socket 15 times. The socket should meet the LGA2011-0 land FCLGA10 requirements 

detailed in the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families 
Thermal/Mechanical Design Guide

.

Static Compressive Load

890 N [200 lbf]

1, 2, 3, 5

Dynamic Load

540 N [121 lbf]

1, 3, 4, 5

Shear

80 lbs (36.287 kg)

Tensile

35 lbs (15.875 kg)

Torque

35 in.lbs (15.875 kg-cm)