NEC Intel Xeon E5-2420 N8101-571F User Manual

Product codes
N8101-571F
Page of 258
Boxed Processor Specifications
244
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
The STS200C utilizes a fan capable of 4-pin pulse width modulated (PWM) control. Use 
of a 4-pin PWM controlled active thermal solution helps customers meet acoustic 
targets in pedestal platforms through the baseboard’s ability to directly control the RPM 
of the processor heat sink fan. See 
 for more details on fan speed control. 
Also see 
 for more on the 
PWM and PECI interface along with Digital Thermal Sensors (DTS).
10.1.3
Intel Thermal Solution STS200P and STS200PNRW
(Boxed 25.5 mm Tall Passive Heat Sink Solutions)
The STS200P and STS200PNRW are available for use with boxed processors that have 
TDP’s of 130W and lower. These 25.5 mm Tall passive solutions are designed to be used 
in SSI Blades, 1U, and 2U chassis where ducting is present. The use of a 25.5 mm Tall 
heatsink in a 2U chassis is recommended to achieve a lower heatsink T
LA
 and more 
flexibility in system design optimization
 is a representation of the heat 
Figure 10-1. STS200C Passive/Active Combination Heat Sink (with Removable Fan)
Figure 10-2. STS200C Passive/Active Combination Heat Sink (with Fan Removed)