Supermicro XEON 2.8GHz P4X-0028-2M-800L User Manual

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The Intel® Xeon™ processor with 512 KB L2 cache is also offered as an Intel boxed processor.
Intel boxed processors are intended for system integrators who build systems from components
available through distribution channels. The boxed processor is supplied with an unattached
passive heatsink. It also contains an optional active duct solution, called Processor Wind Tunnel
(PWT), to provide adequate airflow across the heatsink. If the chassis or baseboard used contains
an alternate cooling solution that has been thermally validated, the PWT may be discarded. This
chapter documents baseboard and platform requirements for the cooling solution that is supplied
with the boxed processor. This chapter is particularly important for OEM's that manufacture
baseboards and chassis for integrators. 

 and 

 show a mechanical representation

of a boxed processor heatsink.

Drawings in this section reflect only the specifications on the Intel boxed processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designer's responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platform and chassis.