Intel 2030M AW8063801120500 Data Sheet
Product codes
AW8063801120500
Datasheet
25
Electrical Specifications
2.7.3
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads)
unless otherwise stated. All specifications apply to all frequencies and cache sizes
unless otherwise stated.
.
Table 11.
GTL+ Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit
Notes
1
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
V
IL
Input Low Voltage
-0.10
GTLREF – 0.10
V
2, 3
2.
V
IL
is defined as the voltage range at a receiving agent that will be interpreted as a logical low
value.
3.
The V
TT
referred to in these specifications is the instantaneous V
TT
.
V
IH
Input High Voltage
GTLREF + 0.10
V
TT
+ 0.10
V
4.
V
IH
is defined as the voltage range at a receiving agent that will be interpreted as a logical high
value.
5.
V
IH
and V
OH
may experience excursions above V
TT
. However, input signal drivers must comply
with the signal quality specifications.
V
OH
Output High Voltage
V
TT
– 0.10
V
TT
V
I
OL
Output Low Current
N/A
V
TT_MAX
/
[(R
TT_MIN
)+(2*R
ON_MIN
)]
A
-
I
LI
Input Leakage Current
N/A
± 100
µA
6
6.
Leakage to V
SS
with land held at V
TT
.
I
LO
Output Leakage Current
N/A
± 100
µA
7
7.
Leakage to V
TT
with land held at 300 mV
R
ON
Buffer On Resistance
10
13
Ω
Table 12.
Open Drain and TAP Output Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit
Notes
1
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
V
OL
Output Low Voltage
0
0.20
V
-
V
OH
Output High Voltage
V
TT
– 0.05 V
TT
+ 0.05
V
2
2. V
OH
is determined by the value of the external pull-up resister to V
TT
.
I
OL
Output Low Current
16
50
mA
3
3.
Measured at V
TT
* 0.2.
I
LO
Output Leakage Current
N/A
± 200
µA
4
4.
For Vin between 0 and V
OH