Intel 2030M AW8063801120500 Data Sheet
Product codes
AW8063801120500
6
Datasheet
Tables
Voltage Identification Definition..................................................................................15
0], , ,
..............................................16
Absolute Maximum and Minimum Ratings ....................................................................18
Static and Transient Tolerance for Processors .........................................................20
Overshoot Specifications......................................................................................21
Signal Characteristics................................................................................................24
10 Signal Reference Voltages .........................................................................................24
11 GTL+ Signal Group DC Specifications ..........................................................................25
12 Open Drain and TAP Output Signal Group DC Specifications ...........................................25
13 CMOS Signal Group DC Specifications..........................................................................26
14 GTL+ Bus Voltage Definitions .....................................................................................27
15 Core Frequency to FSB Multiplier Configuration.............................................................28
16 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................29
17 Front Side Bus Differential BCLK Specifications .............................................................29
18 Front Side Bus Differential BCLK Specifications .............................................................31
19 PECI DC Electrical Limits ...........................................................................................32
20 Processor Loading Specifications.................................................................................37
21 Package Handling Guidelines......................................................................................37
22 Processor Materials...................................................................................................38
23 Alphabetical Land Assignments...................................................................................44
24 Numerical Land Assignment .......................................................................................54
25 Signal Description.....................................................................................................64
26 Processor Thermal Specifications ................................................................................74
27 Thermal Profile (Intel
11 GTL+ Signal Group DC Specifications ..........................................................................25
12 Open Drain and TAP Output Signal Group DC Specifications ...........................................25
13 CMOS Signal Group DC Specifications..........................................................................26
14 GTL+ Bus Voltage Definitions .....................................................................................27
15 Core Frequency to FSB Multiplier Configuration.............................................................28
16 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................29
17 Front Side Bus Differential BCLK Specifications .............................................................29
18 Front Side Bus Differential BCLK Specifications .............................................................31
19 PECI DC Electrical Limits ...........................................................................................32
20 Processor Loading Specifications.................................................................................37
21 Package Handling Guidelines......................................................................................37
22 Processor Materials...................................................................................................38
23 Alphabetical Land Assignments...................................................................................44
24 Numerical Land Assignment .......................................................................................54
25 Signal Description.....................................................................................................64
26 Processor Thermal Specifications ................................................................................74
27 Thermal Profile (Intel
®
Pentium
®
Dual-Core Processors with CPUID = 06F2h) ..................75
®
Pentium
®
Dual-Core Processors with CPUID = 06FDh) ..................76
29 Thermal “Diode” Parameters using Diode Model............................................................81
30 Thermal “Diode” Parameters using Transistor Model ......................................................82
31 Thermal Diode Interface ............................................................................................82
32 GetTemp0() Error Codes ...........................................................................................85
33 Power-On Configuration Option Signals .......................................................................87
34 Fan Heatsink Power and Signal Specifications...............................................................97
35 Fan Heatsink Power and Signal Specifications............................................................. 101
30 Thermal “Diode” Parameters using Transistor Model ......................................................82
31 Thermal Diode Interface ............................................................................................82
32 GetTemp0() Error Codes ...........................................................................................85
33 Power-On Configuration Option Signals .......................................................................87
34 Fan Heatsink Power and Signal Specifications...............................................................97
35 Fan Heatsink Power and Signal Specifications............................................................. 101