Intel 2030M AW8063801120500 Data Sheet

Datasheet

93

The processor will also be offered as an Intel boxed processor. Intel boxed processors 

are intended for system integrators who build systems from baseboards and standard 

components. The boxed processor will be supplied with a cooling solution. This chapter 

documents baseboard and system requirements for the cooling solution that will be 

supplied with the boxed processor. This chapter is particularly important for OEMs that 

manufacture baseboards for system integrators. Unless otherwise noted, all figures in 

this chapter are dimensioned in millimeters and inches [in brackets]. 

 shows a 

mechanical representation of a boxed processor.

Drawings in this section reflect only the specifications on the Intel boxed processor 

product. These dimensions should not be used as a generic keep-out zone for all 

cooling solutions. It is the system designers’ responsibility to consider their proprietary 

cooling solution when designing to the required keep-out zone on their system 

platforms and chassis. Refer to the appropriate Thermal and Mechanical Design 

Guidelines (see 

) for further guidance. Contact your local Intel Sales 

Representative for this document.

 

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.