Intel i3-3130M AW8063801111500 User Manual

Product codes
AW8063801111500
Page of 112
Datasheet, Volume 1
75
Electrical Specifications 
7
Electrical Specifications
7.1
Power and Ground Lands
The processor has VCC, VDDQ, VCCPLL, VCCSA, VCCAXG, VCCIO and VSS (ground) 
inputs for on-chip power distribution. All power lands must be connected to their 
respective processor power planes, while all VSS lands must be connected to the 
system ground plane. Use of multiple power and ground planes is recommended to 
reduce I*R drop. The VCC and VCCAXG lands must be supplied with the voltage 
determined by the processor Serial Voltage IDentification (SVID) interface. A new 
serial VID interface is implemented on the processor. 
level for the various VIDs.
7.2
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is 
capable of generating large current swings between low- and full-power states. This 
may cause voltages on power planes to sag below their minimum values, if bulk 
decoupling is not adequate. Larger bulk storage (C
BULK
), such as electrolytic capacitors, 
supply current during longer lasting changes in current demand (for example, coming 
out of an idle condition). Similarly, capacitors act as a storage well for current when 
entering an idle condition from a running condition. To keep voltages within 
specification, output decoupling must be properly designed.
Caution:
Design the board to ensure that the voltage provided to the processor remains within 
the specifications listed in 
. Failure to do so can result in timing violations or 
reduced lifetime of the processor. 
7.2.1
Voltage Rail Decoupling
The voltage regulator solution needs to provide:
• bulk capacitance with low effective series resistance (ESR)
• a low interconnect resistance from the regulator to the socket
• bulk decoupling to compensate for large current swings generated during poweron, 
or low-power idle state entry/exit
The power delivery solution must ensure that the voltage and current specifications are 
met, as defined in