Intel i3-3130M AW8063801111500 User Manual
Product codes
AW8063801111500
Datasheet, Volume 1
83
Electrical Specifications
7.9
Storage Conditions Specifications
Environmental storage condition limits define the temperature and relative humidity to
which the device is exposed to while being stored in a moisture barrier bag. The
specified storage conditions are for component level prior to board attach.
which the device is exposed to while being stored in a moisture barrier bag. The
specified storage conditions are for component level prior to board attach.
specifies absolute maximum and minimum storage temperature limits that
represent the maximum or minimum device condition beyond which damage, latent or
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. Failure to adhere to the
following specifications can affect long term reliability of the processors conditions
outside sustained limits, but within absolute maximum and minimum ratings, quality
and reliability may be affected.
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. Failure to adhere to the
following specifications can affect long term reliability of the processors conditions
outside sustained limits, but within absolute maximum and minimum ratings, quality
and reliability may be affected.
Notes:
1.
Refers to a component device that is not assembled in a board or socket and is not electrically connected to
a voltage reference or I/O signal.
2.
Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount
reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
3.
T
absolute storage
applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags, or desiccant.
4.
Component product device storage temperature qualification methods may follow JESD22-A119 (low temp)
and JESD22-A103 (high temp) standards when applicable for volatile memory.
5.
Intel branded products are specified and certified to meet the following temperature and humidity limits
that are given as an example only (Non-Operating Temperature Limit: -40
°C
to
70
°C and Humidity: 50%
to 90%, non-condensing with a maximum wet bulb of 28
°C.)
Post
board
attach
storage
temperature
limits
are not specified for non-Intel branded boards.
6.
The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
7.
Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
sustained storage
and customer shelf life in applicable Intel boxes and bags.
Table 7-3.
Storage Condition Ratings
Symbol
Parameter
Min
Max
Notes
T
absolute storage
The non-operating device storage temperature.
Damage (latent or otherwise) may occur when
exceeded for any length of time.
-25
°C
125
°C
1, 2, 3, 4
T
sustained storage
The ambient storage temperature (in shipping
media) for a sustained period of time
-5
°C
40
°C
5,
6
T
short term storage
The ambient storage temperature (in shipping
media) for a short period of time.
-20
°C
85
°C
RH
sustained storage
The maximum device storage relative humidity
for a sustained period of time.
60% at 24
°C
6,
7
Time
sustained storage
A prolonged or extended period of time; typically
associated with customer shelf life.
0 Months
30 Months
7
Time
short term storage
A short-period of time;
0 hours
72 hours