Intel E3-1225 v3 BX80646E31225V3 User Manual
Product codes
BX80646E31225V3
1.4
Thermal Management Support
•
Digital Thermal Sensor
•
Adaptive Thermal Monitor
•
THERMTRIP# and PROCHOT# support
•
On-Demand Mode
•
Memory Open and Closed Loop Throttling
•
Memory Thermal Throttling
•
External Thermal Sensor (TS-on-DIMM and TS-on-Board)
•
Render Thermal Throttling
•
Fan speed control with DTS
1.5
Package Support
The processor socket type is noted as LGA 1150. The package is a 37.5 x 37.5 mm
Flip Chip Land Grid Array (FCLGA 1150). See the appropriate Processor Thermal
Mechanical Design Guidelines and LGA1150 Socket Application Guide for complete
details on the package.
1.6
Terminology
Table 1.
Terminology
Term
Description
APD
Active Power-down
B/D/F
Bus/Device/Function
BGA
Ball Grid Array
BLC
Backlight Compensation
BLT
Block Level Transfer
BPP
Bits per pixel
CKE
Clock Enable
CLTM
Closed Loop Thermal Management
DDI
Digital Display Interface
DDR3
Third-generation Double Data Rate SDRAM memory technology
DLL
Delay-Locked Loop
DMA
Direct Memory Access
DP
DisplayPort*
DTS
Digital Thermal Sensor
EC
Embedded Controller
ECC
Error Correction Code
continued...
Processor—Introduction
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
June 2013
12
Order No.: 328907-001