Intel E3-1225 v3 BX80646E31225V3 User Manual
Product codes
BX80646E31225V3
Performance Targets
The following table provides boundary conditions and performance targets as guidance
for thermal solution design. Thermal solutions must be able to comply with the
Maximum T
CASE
Thermal Profile.
Table 20.
Boundary Conditions, Performance Targets, and T
CASE
Specifications
Processor
PCG
2
Package
TDP
3
Platform
TDP
4
Heatsink
5
T
LA
,
Airflow,
RPM,
Ѱ
CA
6
Maximum
T
CASE
Thermal
Profile
7
T
CASE-MAX
@
Platform
TDP
8
4C/GT2 95 W
1
Workstation
2013D
84 W
87 W
Active Cu
Core (DHA-A)
40 °C,
3100 RPM,
0.383 °C/W
y = 0.33 *
Power + 45.0
73.7 °C
4C/GT2 95 W
1
84 W
87 W
1U Al
Heatpipe
40 °C,
11.5 CFM,
0.383 °C/W
73.7 °C
4C/GT0 95 W
1
80 W
82 W
1U Al
Heatpipe
42 °C,
11.5 CFM,
0.383 °C/W
y = 0.33 *
Power + 46.6
73.6 °C
4C/GT0 80 W
1
80 W
80 W
1U Al
Heatpipe
42 °C,
11.5 CFM,
0.383 °C/W
73.0 °C
4C/GT2 65 W
1
2013C
65 W
65 W
Active Al
Core (DHA-B)
40 °C,
3100 RPM,
0.487 °C/W
y = 0.41 *
Power + 44.7
71.3 °C
4C/GT1 45 W
1
2013B
45 W
45 W
Active Short
(DHA-D)
44.5 °C,
3000 RPM,
0.597 °C/W
y = 0.51 *
Power + 48.5
71.4 °C
continued...
Processor—Thermal Management
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
June 2013
68
Order No.: 328907-001