Intel Phi 5120D SC5120D User Manual

Product codes
SC5120D
Page of 4
better Performance, 
            More Flexibility
Table 1. Intel® Xeon Phi™ Coprocessor Family Overview
FEATURES
DETAIlS
BENEFITS
Intel® Many Integrated Cores  
(MIC) architecture
•  Up to 61 cores, 244 threads, and 16 GB of GDDR5 memory 
 (352 GB/s bandwidth) per coprocessor
•  Double-wide (256-bit) vector engines and 512-bit  
SIMD instructions
•  Ideal for highly-parallel, vector-intensive, and memory- 
bound code
Up to 1.2 teraflops of  
double-precision performance  
per coprocessor
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Familiar Intel® architecture  
programming model
Developers can:
•  Use familiar methods and tools, including the latest Intel® Software 
Development products
•  Maintain a common code base for Intel® Xeon® processors and Intel® 
Xeon Phi™ coprocessors
Simplified development  
and dual-benefit for 
performance optimization
Linux* hosting capability
Run each coprocessor under the host operating system or as an 
independent server running Red Hat Enterprise Linux* 6.x or SuSE  
Linux* 12+ 
Exceptional execution flexibility
IP Addressable
Supports standard clustering models.
Simple scaling
Industry-leading silicon technology
•  Intel 22 nm technology with 3D Tri-Gate transistors
•  Power envelopes as low as 225 Watts per coprocessor
Exceptional compute density 
and energy efficiency
Flexible form factors
•  Standard x16 PCIe* cards (with active, passive, or no thermal solution) 
and a unique dense form factor (DFF) for more customized integration
•  Use up to 8 coprocessors per host server
Flexible integration and 
scalability
Flexible Execution Models
•  Multicore only – MAIN() runs on host processor
•  Multicore Hosted with Manycore Offload – MAIN() runs on host 
processor and select routines are executed on the coprocessor
•  Symmetric execution – MAIN() runs symmetrically on processor  
and coprocessor
•  Manycore only – Boot from host processor, MAIN() runs 
on coprocessor
Best flexibility for optimizing  
workload performance
Table 2. Intel® Xeon Phi™ Product Family Specifications
PRODUCT 
NUMBER
FORM 
FACTOR &, 
THERMAl 
SOlUTION
4
BOARD  
TDP (WATTS)
NUMBER  
OF CORES
FREqUENCY 
(GHz)
PEAk DOUBlE 
PRECISION  
PERFORMANCE 
(GFlOP)
PEAk  
MEMORY 
BANDWIDTH 
(GB/s)
MEMORY 
CAPACITY
(GB)
INTEl®  
TURBO  
BOOST  
TECHNOlOGY 
3120P
PCIe, Passive 300
57
1.1
1003
240
6
N/A
3120A
PCIe, Active
300
57
1.1
1003
240
6
N/A
5110P
PCIe, Passive 225
60
1.053
1011
320
8
N/A
5120D
Dense form 
factor, None
245
60
1.053
1011
352
8
N/A
7110P
PCIe, Passive 300
61
1.238
1208
352
16
Peak turbo 
frequency: 
1.33 GHz
7120X
PCIe, None
300
61
1.238
1208
352
16
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