Intel E5-4640 v2 CM8063501285713 User Manual

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

107

Datasheet Volume One

1.

These values are specified at V

CC_MAX

 for all processor frequencies. Systems must be designed to ensure 

the processor is not to be subjected to any static V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

CC_MAX

 at 

specified ICC. Please refer to the electrical loadline specifications in 

.

2.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 

maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

3.

These specifications are based on final silicon characterization.

4.

Power specifications are defined at all VIDs found in 

. The processor may be delivered under 

multiple VIDs for each frequency.

5.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor 

frequency requirements. 

1.

This Thermal Profile is representative of a volumetrically unconstrained platform. Please refer to 

for discrete points that constitute the thermal profile.

2.

Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® 

for 

system and environmental implementation details.

Launch to FMB

135

5

See 

1, 2, 3, 4, 5