Intel Celeron M 520 1.60 GHz BX80537520 Data Sheet
Product codes
BX80537520
32
Intel
®
Celeron
®
M Processor Datasheet
Package Mechanical Specifications and Pin Information
Table 14. Micro-FCPGA Package Dimensions
NOTE: Overall height with socket is based on design dimensions of the Micro-FCPGA package with no thermal
solution attached. Values are based on design specifications and tolerances. This dimension is subject
to change based on socket design, OEM motherboard design or OEM SMT process.
to change based on socket design, OEM motherboard design or OEM SMT process.
Symbol Parameter
Min
Max
Unit
A
Overall height, top of die to package seating plane
1.88
2.02
mm
-
Overall height, top of die to PCB surface, including
socket (Refer to Note 1)
socket (Refer to Note 1)
4.74 5.16 mm
A1 Pin
length
1.95 2.11 mm
A2 Die
height
0.82
mm
A3
Pin-side capacitor height
-
1.25
mm
B
Pin
diameter
0.28 0.36 mm
D
Package
substrate
length
34.9 35.1 mm
E
Package
substrate
width
34.9 35.1 mm
D1 Die
length
10.56
mm
E1 Die
width
7.84
mm
F
To Package Substrate Center
17.5
mm
G
Die Offset from Package Center
1.133
mm
e Pin
pitch
1.27 mm
K Package
edge
keep-out
5
mm
K1 Package
corner
keep-out
7
mm
K3
Pin-side capacitor boundary
14
mm
-
Pin tip radial true position
<=0.254
mm
N Pin
count
478 each
Pdie
Allowable pressure on the die for thermal solution
-
689
kPa
W Package
weight
4.5
g
Package
Surface
Flatness
0.286 mm