Intel G1620T CM8063701448300 User Manual
Product codes
CM8063701448300
Package Information
106
Datasheet
9
Package Information
The processor comes in a 25 mm X 27 mm Flip-Chip Ball Grid Array (FCBGA) package
and consists of a silicon die mounted face down on an organic substrate populated with
1170 solder balls on the bottom side. Capacitors may be placed in the area surrounding
the die. Because the die-side capacitors are electrically conductive, and only slightly
shorter than the die height, care should be taken to avoid contacting the capacitors
with electrically conductive materials. Doing so may short the capacitors and possibly
damage the device or render it inactive.
and consists of a silicon die mounted face down on an organic substrate populated with
1170 solder balls on the bottom side. Capacitors may be placed in the area surrounding
the die. Because the die-side capacitors are electrically conductive, and only slightly
shorter than the die height, care should be taken to avoid contacting the capacitors
with electrically conductive materials. Doing so may short the capacitors and possibly
damage the device or render it inactive.
The use of an insulating material between the capacitors and any thermal solution
should be considered to prevent capacitor shorting. An exclusion, or keep out zone,
surrounds the die and capacitors, and identifies the contact area for the package. Care
should be taken to avoid contact with the package inside this area.
should be considered to prevent capacitor shorting. An exclusion, or keep out zone,
surrounds the die and capacitors, and identifies the contact area for the package. Care
should be taken to avoid contact with the package inside this area.
9.1
Processor Attributes
•
Package parameters: 25 mm X 27 mm
•
Ball Count:1170
All Units: mm
Tolerances if not specified:
•
.X: ± 0.1
•
.XX: ± 0.05
•
Angles: ± 1.0 degrees