Intel G1620T CM8063701448300 User Manual
Product codes
CM8063701448300
Electrical Specifications
78
Datasheet
8.2
Storage Conditions
This section specifies the absolute maximum and minimum storage temperature and
humidity limits for given time durations. Failure to adhere to the specified limits could
result in physical damage to the component. If this is suspected, Intel recommends a
visual inspection to determine possible physical damage to the silicon or surface
components.
humidity limits for given time durations. Failure to adhere to the specified limits could
result in physical damage to the component. If this is suspected, Intel recommends a
visual inspection to determine possible physical damage to the silicon or surface
components.
Note:
•
Specified temperatures are not to exceed values based on data collected.
Exceptions for surface mount re-flow are specified by the applicable JEDEC
standard. Non-adherence may affect processor reliability.
Exceptions for surface mount re-flow are specified by the applicable JEDEC
standard. Non-adherence may affect processor reliability.
•
Component product device storage temperature qualification methods may follow
JESD22-A119 (low temperature) and JESD22-A103 (high temperature) standards
when applicable for volatile memory.
JESD22-A119 (low temperature) and JESD22-A103 (high temperature) standards
when applicable for volatile memory.
•
Component stress testing is conducted in conformance with JESD22-A104.
•
The JEDEC J-JSTD-020 moisture level rating and associated handling practices
apply to all moisture sensitive devices removed from the moisture barrier bag.
apply to all moisture sensitive devices removed from the moisture barrier bag.
8.2.1
Post Board-Attach
The storage condition limits for the component once attached to the application board
are not specified. Intel does not conduct component-level certification assessments
post board-attach given the multitude of attach methods, socket types, and board
types used by customers.
are not specified. Intel does not conduct component-level certification assessments
post board-attach given the multitude of attach methods, socket types, and board
types used by customers.
Provided as general guidance only, board-level Intel-branded products are specified
and certified to meet the following temperature and humidity limits:
and certified to meet the following temperature and humidity limits:
J2900 - Quad Core Pentium
0 to 105 °C
10 W @ 100 °C
-
J1900 - Quad Core Celeron
0 to 105 °C
10 W @ 100 °C
-
J1800 - Dual Core Celeron
0 to 105 °C
10 W @ 100 °C
-
Table 51. Processor Thermal Specifications (Sheet 2 of 2)
SKU
T
j
Max
TDP
SDP
Table 52. Storage Conditions Prior to Board Attach
Symbol
Parameter
Min
Max
Tabsolute storage
Device storage temperature when exceeded for
any length of time.
-25 °C
125 °C
Tshort term storage
The ambient storage temperature and time for
up to 72 hours.
-25 °C
85 °C
Tsustained storage
The ambient storage temperature and time for
up to 30 months.
-5 °C
40 °C
RHsustained storage
The maximum device storage relative humidity
for up to 30 months.
60% @ 24 °C