Intel Celeron M 420 1.60 GHz LF80538NE0251M Data Sheet

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The Intel

 

Celeron M processor requires a thermal solution to maintain temperatures within 

operating limits. A complete thermal solution includes both component and system level thermal 

management features. Component level thermal solutions include active or passive heatsinks or 

heat exchangers attached to the processor exposed die. The solution should make firm contact with 

the die while maintaining processor mechanical specifications such as pressure. A typical system 

level thermal solution may consist of a processor fan ducted to a heat exchanger that is thermally 

coupled to the processor using a heat pipe or direct die attachment. A secondary fan or air from the 

processor fan may also be used to cool other platform components or lower the internal ambient 

temperature within the system. The processor must remain within the minimum and maximum 

junction temperature (Tj) specifications at the corresponding thermal design power (TDP) value 

listed in 

. The maximum junction temperature is defined by an activation of the Intel 

Thermal Monitor in the processor.

Refer to 

 for more details. Analysis indicates that real applications are unlikely to 

cause the processor to consume the theoretical maximum power dissipation for sustained time 

periods. Intel recommends that complete thermal solution designs target the TDP indicated in 

. The Intel

®

 Thermal Monitor feature is designed to help protect the processor in the 

unlikely event that an application exceeds the TDP recommendation for a sustained period of time. 

For more details on the usage of this feature, refer to 

. In all cases the Intel Thermal 

Monitor feature must be enabled for the processor to remain within specification.