Intel Pentium D 830 HH80551PG0802MN Data Sheet

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A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active 
state when driven to a low level. For example, when RESET# is low, a reset has been requested. 
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where 
the name does not imply an active state but describes part of a binary sequence (such as address or 
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a 
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

“FSB” refers to the interface between the processor and system core logic (a.k.a. the chipset 
components). The FSB is a multiprocessing interface to processors, memory, and I/O.

Commonly used terms are explained here for clarification:

•

 D processor 800 sequence — Dual-core processor in the FC-LGA4 

package with two 1-MB L2 caches.

•

Processor — For this document, the term processor is the generic form of the Intel Pentium D 
processor 800 sequence.

•

Keep-out zone — The area on or near the processor that system design can not use.

•

 945G/945GZ/945P/945PL Express Chipset Family — Chipset that supports DDR2 

memory technology for the Pentium D processor.

•

 955X Express Chipset — Chipset that supports DDR2 memory technology for the 

Pentium D processor.

•

Processor core — Processor core die with integrated L2 cache. 

•

FC-LGA4 package — The Pentium D processor is available in a Flip-Chip Land Grid Array 
4 package, consisting of a processor core mounted on a substrate with an integrated heat 
spreader (IHS).

•

LGA775 socket — The Pentium D processor mates with the system board through a surface 
mount, 775-land, LGA socket.

•

Integrated heat spreader (IHS) — A component of the processor package used to enhance 
the thermal performance of the package. Component thermal solutions interface with the 
processor at the IHS surface.

•

Retention mechanism (RM) — Since the LGA775 socket does not include any mechanical 
features for heatsink attach, a retention mechanism is required. Component thermal solutions 
should attach to the processor via a retention mechanism that is independent of the socket.

•

Storage conditions — Refers to a non-operational state. The processor may be installed in a 
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. 
Under these conditions, processor lands should not be connected to any supply voltages, have 
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or 
a device removed from packaging material) the processor must be handled in accordance with 
moisture sensitivity labeling (MSL) as indicated on the packaging material.

•

Functional operation — Refers to normal operating conditions in which all processor 
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are 
satisfied.