Intel Pentium D 830 HH80551PG0802MN Data Sheet

Product codes

HH80551PG0802MN

Datasheet

Package Mechanical Specifications

Package Mechanical
Specifications

The Intel

Pentium

D processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package

that interfaces with the motherboard via an LGA775 socket. The package consists of a processor
core mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the
package substrate and core and serves as the mating surface for processor component thermal
solutions, such as a heatsink.

Figure 3-1

shows a sketch of the processor package components and

how they are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for
complete details on the LGA775 socket.

The package components shown in

Figure 3-1

include the following:

•

Integrated Heat Spreader (IHS)

•

Thermal Interface Material (TIM)

•

Processor core (die)

•

Package substrate

•

Capacitors

NOTE:

1. Socket and motherboard are included for reference and are not part of processor package.

3.1

Package Mechanical Drawing

The package mechanical drawings are shown in

Figure 3-2

and

Figure 3-4

. The drawings include

dimensions necessary to design a thermal solution for the processor. These dimensions include:

•

Package reference with tolerances (total height, length, width, etc.)

•

IHS parallelism and tilt

•

Land dimensions

•

Top-side and back-side component keep-out dimensions

•

Reference datums

•

All drawing dimensions are in mm [in].

Note:

Guidelines on potential IHS flatness variation with socket load plate actuation and installation of
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.

Figure 3-1. Processor Package Assembly Sketch

System Board

LGA775 Socket

Capacitors

TIM

Core (die)

IHS

Substrate

775