AMD Sempron 3000+ Tray Socket 754 SDA3000AIO2BO Product Datasheet
Product codes
SDA3000AIO2BO
AMD Sempron™
Product Data Sheet
Product Data Sheet
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Compatible with Existing 32-Bit Code Base
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Including support for SSE, SSE2, MMX™,
3DNow!™ technology and legacy x86 instructions
3DNow!™ technology and legacy x86 instructions
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Runs existing operating systems and drivers
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Local APIC on-chip
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Integrated Memory Controller
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Low-latency, high-bandwidth
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64-bit DDR SDRAM at 100, 133, 166, and 200 MHz
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Supports up to three unbuffered DIMMs
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ECC checking with double-bit detect and single-bit
correct
correct
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HyperTransport™ Technology to I/O Devices
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One 16-bit link supporting speeds up to 800 MHz
(1600 MT/s) or 3.2 Gigabytes/s in each direction
(1600 MT/s) or 3.2 Gigabytes/s in each direction
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64-Kbyte 2-Way Associative ECC-Protected
L1 Data Cache
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L1 Data Cache
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Two 64-bit operations per cycle, 3-cycle latency
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64-Kbyte 2-Way Associative Parity-Protected
L1 Instruction Cache
L1 Instruction Cache
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256-Kbyte 16-Way Associative ECC-Protected
L2 Cache
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L2 Cache
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Exclusive cache architecture—storage in addition
to L1 caches
to L1 caches
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Machine Check Architecture
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Includes hardware scrubbing of major
ECC-protected arrays
ECC-protected arrays
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Power Management
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Multiple low-power states
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System Management Mode (SMM)
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ACPI compliant, including support for processor
performance states
performance states
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Electrical Interfaces
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HyperTransport™ Technology: LVDS-like
differential, unidirectional
differential, unidirectional
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DDR SDRAM: SSTL_2 per JEDEC specification
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Clock, reset, and test signals also use DDR
SDRAM-like electrical specifications
SDRAM-like electrical specifications
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Packaging
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754 pin lidded micro PGA
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1.27-mm pin pitch
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29x29 row pin array
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40mm x 40mm organic substrate
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Organic C4 die attach
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Refer to the AMD Functional Data Sheet, 754
Pin Package, order# 31410, for functional,
electrical, and mechanical details of 754 pin
package processors
Pin Package, order# 31410, for functional,
electrical, and mechanical details of 754 pin
package processors
31805
Publication #
3.00
Revision:
August 2004
Issue Date: