Intel Celeron 360 HH80552RE099512 User Manual

Product codes
HH80552RE099512
Page of 95
Datasheet
81
Thermal Specifications and Design Considerations
5.2.3
PROCHOT# Signal
An external signal, PROCHOT# (processor hot), is asserted when the processor die 
temperature has reached its maximum operating temperature. If the Thermal Monitor 
is enabled (note that the Thermal Monitor must be enabled for the processor to be 
operating within specification), the TCC will be active when PROCHOT# is asserted. The 
processor can be configured to generate an interrupt upon the assertion or de-
assertion of PROCHOT#. Refer to the Intel Architecture Software Developer's Manuals 
for specific register and programming details.
The Celeron D processor implements a bi-directional PROCHOT# capability to allow 
system designs to protect various components from over-temperature situations. The 
PROCHOT# signal is bi-directional in that it can either signal when the processor has 
reached its maximum operating temperature or be driven from an external source to 
activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means 
for thermal protection of system components. 
One application is the thermal protection of voltage regulators (VR). System designers 
can create a circuit to monitor the VR temperature and activate the TCC when the 
temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and 
activating the TCC, the VR can cool down as a result of reduced processor power 
consumption. Bi-directional PROCHOT# can allow VR thermal designs to target 
maximum sustained current instead of maximum current. Systems should still provide 
proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in 
case of system cooling failure. Refer to the Voltage Regulator-Down (VRD) 10.1 Design 
Guide For Desktop and Transportable LGA775 Socket for details on implementing the 
bi-directional PROCHOT# feature.
5.2.4
THERMTRIP# Signal
Regardless of whether or not Thermal Monitor is enabled, in the event of a catastrophic 
cooling failure, the processor will automatically shut down when the silicon has reached 
an elevated temperature (refer to the THERMTRIP# definition in 
). At this 
point, the FSB signal THERMTRIP# will go active and stay active as described in 
. THERMTRIP# activation is independent of processor activity and does not 
generate any bus cycles.
5.2.5
T
CONTROL
 and Fan Speed Reduction
T
CONTROL
 is a temperature specification based on a temperature reading from the 
thermal diode. The value for T
CONTROL
 will be calibrated in manufacturing and 
configured for each processor. When T
DIODE
 is above T
CONTROL
 then T
C
 must be at or 
below T
C_MAX
 as defined by the thermal profile in 
temperature can be maintained at T
CONTROL
 (or lower) as measured by the thermal 
diode.
The purpose of this feature is to support acoustic optimization through fan speed 
control. Contact your field representative for further details. 
5.2.6
Thermal Diode
The processor incorporates an on-die PNP transistor whose base emitter junction is 
used as a thermal "diode", with its collector shorted to Ground. A thermal sensor 
located on the system board may monitor the die temperature of the processor for 
thermal management and fan speed control. 
provide the "diode" parameter and interface specifications. Two different sets of "diode" 
parameters are listed in 
. The Diode Model parameters (
) apply 
to traditional thermal sensors that use the Diode Equation to determine the processor