Intel G1840 BX80646G1840 User Manual

Datasheet, Volume 1

21

Introduction

Storage Conditions

A non-operational state. The processor may be installed in a platform, in a tray, or 

loose. Processors may be sealed in packaging or exposed to free air. Under these 

conditions, processor landings should not be connected to any supply voltages, have 

any I/Os biased or receive any clocks. Upon exposure to “free air” (that is, unsealed 

packaging or a device removed from packaging material) the processor must be 

handled in accordance with moisture sensitivity labeling (MSL) as indicated on the 

packaging material.

SVID

Serial Voltage IDentification interface

TAC

Thermal Averaging Constant

TAP

Test Access Point

TCC

Thermal Control Circuit

TDC

Thermal Design Current

TDP

Thermal Design Power

TLP

Transaction Layer Packet

V

AXG

Graphics core power supply

V

CC

Processor core power supply

V

CCIO

High Frequency I/O logic power supply

V

CCPLL

PLL power supply

V

CCSA

System Agent (memory controller, DMI, PCIe controllers, and display engine) power 

supply

V

DDQ

DDR3 power supply

VGA

Video Graphics Array

VID

Voltage Identification

VLD

Variable Length Decoding

VLW

Virtual Legacy Wire

VR

Voltage Regulator

V

SS

Processor ground

VTS

Virtual Temperature Sensor

x1

Refers to a Link or Port with one Physical Lane.

x16

Refers to a Link or Port with sixteen Physical Lanes.

x4

Refers to a Link or Port with four Physical Lanes.

x8

Refers to a Link or Port with eight Physical Lanes.