Intel Phi 7120A SC7120A Data Sheet

Document ID Number: 328209 003EN

Intel

®

 Xeon Phi™ Coprocessor Datasheet

13

The Intel® Xeon Phi™ coprocessor 7120D/5120D products, also known as Dense Form 

Factor (DFF), are derivatives of the standard Intel® Xeon Phi™ coprocessor PCI 

Express* form-factor card. The high-level features of the DFFs are:

• Maximum TDP of 270W for the 7120D and 245W for the 5120D
• GDDR on both sides of the card.
• 117.35mm(4.62”) x 149.86mm(5.9”) PCB.
• 230-pin unique edge finger designed to industry standard x24 PCI Express* 

connector, PCI Express* 2.0 compliant. The unique edge finger pin definition 
requires signal routing on baseboard and 12V filter per card.

• All power to the card is supplied through the connector.
• There is no auxiliary 2x4 or 2x3 power connector on the card.
• Supports vertical, straddle or right-angle mating connectors.
• On board SMC. The manageability features and software capabilities remain the 

same as for other Intel® Xeon Phi™ coprocessor products.

• To allow for system design innovation and differentiation, Intel will ship only the 

assembled and fully functional PCB, without heatsink or chassis retention 
mechanism. This allows system designers to implement their own cooling solution 
and connector of choice. Due to presence of GDDR5 memory components on the 
backside of the DFF board, a custom cooling design must comprehend both sides of 
the DFF product.

• Baseboard designers must ensure the signal integrity of all PCI Express* signals as 

they pass the connector of choice and reach the connector fingers of the DFF 
product.

1. Passive cooling solution uses topside heatsink (vapor chamber and copper fins) and backside aluminum plate. Active

cooling uses on-card dual-intake blower.

3120A

300

Active

3120P / 7120P / SE10P

300

Passive

2,4

 

2. SE10P/SE10X are limited edition one-time only SKUs.

7120X / SE10X

300

None

2,3,4

3. Same performance and card configuration as the  7120P/SE10P  but without Intel heatsink or chassis retention

mechanism; allows for custom thermal and mechanical design by users.

4. 7120P/7120X feature Turbo.

31S1P

270

Passive

7120A

270

Active

7120D

270

None

6

5120D 245 

None

5

5. Dense Form Factor (DFF): Smaller physical footprint than the other Intel® Xeon Phi™ coprocessor products, for

innovative platform designs with unique PCI Express* interface, PCI Express* 2.0 specification compliant.

5110P

6

6. Refer to 

 for note on total card TDP of 5110P.

225

Passive