Kingston Technology Memory HyperX 256MB 333Mhz DDR nonECC C2 KHX2700/256 Data Sheet
Product codes
KHX2700/256
Memory Module Specification
Document No. 4803409-001.C00
03/04/03
KHX2700/256
256MB 32M x 64-Bit PC2700
CL2 184-Pin DIMM
KEY
ED
Page 1
DESCRIPTION:
This document describes Kingston's 32M x 64-bit (256MB) DDR333 SDRAM (Synchronous
DRAM) CL2 memory module. The components on this module include eight 32M x 8-bit (8M x 8-
bit x 4 Bank / 166MHz, 6ns) DDR333 SDRAM in TSOP packages. This 184-pin DIMM uses gold
contact fingers and requires +2.6V. The electrical and mechanical specifications are as follows:
DRAM) CL2 memory module. The components on this module include eight 32M x 8-bit (8M x 8-
bit x 4 Bank / 166MHz, 6ns) DDR333 SDRAM in TSOP packages. This 184-pin DIMM uses gold
contact fingers and requires +2.6V. The electrical and mechanical specifications are as follows:
FEATURES:
Power supply : Vdd: 2.6V ± 0.1V, Vddq: 2.6V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 2 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 2-2-2-5-1 at +2.6V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.200” (30.48mm), single sided component
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 2 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 2-2-2-5-1 at +2.6V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.200” (30.48mm), single sided component
PERFORMANCE:
Clock Cycle Time (tCK)
6ns (min.) / 12ns (max.)
Row Cycle Time (tRC)
60ns (min.)
Refresh Row Cycle Time (tRFC) 72ns (min.)
Row Active Time (tRAS)
Row Active Time (tRAS)
42ns (min.) / 100,000ns (max.)
Power (IDD0)
2.200 W (operating)
UL Rating
94 V - 0
Operating Temperature
0
o
C to 70
o
C
Storage Temperature
-55
o
C to +150
o
C