Intel i3-4360T CM8064601481958 User Manual

The following table provides boundary conditions and performance targets as guidance

for thermal solution design. Thermal solutions must be able to comply with the

Maximum T

CASE

 Thermal Profile.

4C/GT2 95W

1

2014

88W

88W

Active Cu

Core (DHA-A)

40 °C,

3100 RPM,

0.358 °C/W

y = 0.33 *

Power + 45.0

74.0 °C

4C/GT2 95W

1

2013D

84W

84W

Active Cu

Core (DHA-A)

40 °C,

3100 RPM,

0.381 °C/W

y = 0.33 *

Power + 45.0

72.7 °C

4C/GT2 65W

1

2013C

65W

65W

Active Al

Core (DHA-B)

40 °C,

3100 RPM,

0.485 °C/W

y = 0.41 *

Power + 44.7

71.4 °C

2C/GT2 65W

1

54W

54W

Active Al

Core (DHA-B)

40 °C,

3100 RPM,

0.495 °C/W

y = 0.41 *

Power + 44.7

66.8 °C

2C/GT1 65W

1

53W

53W

Active Al

Core (DHA-B)

40 °C,

3100 RPM,

0.495 °C/W

y = 0.41 *

Power + 44.7

66.4 °C

4C/GT2 45W

1

2013B

45W

45W

Active Short

(DHA-D)

45 °C,

3000 RPM,

0.595 °C/W

y = 0.51 *

Power + 48.5

71.5 °C

4C/GT2 35W

1

35W

35W

Active Short

(DHA-D)

45 °C,

3000 RPM,

0.595 °C/W

y = 0.51 *

Power + 48.5

66.4 °C

2C/GT2 35W

1

35W

35W

Active Short

(DHA-D)

45 °C,

3000 RPM,

0.595 °C/W

y = 0.51 *

Power + 48.5

66.4 °C

Notes: 1. TDP shown here, 95W for example, represents the maximum expected platform TDP in the next generation

platform for this type of SKU. This placeholder value is provided as a guideline for hardware design for the next

generation platform.

2. Platform Compatibility Guide (PCG) provides a design target for meeting all planned processor frequency

 on page 102.

3. .N/A
4. These boundary conditions and performance targets are used to generate processor thermal specifications and to

provide guidance for heatsink design. Values are for the heatsink shown in the adjacent column are calculated at

sea level, and are expected to meet the Thermal Profile at TDP. T

LA

 is the local ambient temperature of the

heatsink inlet air. Airflow is through the heatsink fins with zero bypass for a passive heatsink. RPM is fan

revolutions per minute for an active heatsink. Ѱ

CA

 is the maximum target (mean + 3 sigma) for the thermal

characterization parameter. For more information on the thermal characterization parameter, refer to the processor

Thermal Mechanical Design Guidelines (see Related Documents section).

5. Maximum T

CASE

 Thermal Profile is the specification that must be complied to. Any Attempt to operate the processor

outside these operating limits may result in permanent damage to the processor and potentially other system

components.

6. T

CASE-MAX

 at Platform TDP is calculated using the maximum T

CASE

 Thermal Profile and the platform TDP.

7. ATCA Reference Heatsink supports Socket B and is not tooled for Socket H.

Desktop 4th Generation Intel

®

 Core

™

 Processor Family, Desktop Intel

®

 Pentium

®

 Processor Family, and Desktop Intel

®

 Celeron

®

Processor Family

July 2014

Datasheet – Volume 1 of 2

Order No.: 328897-009

77