Intel Xeon 5130 2.0GHz 124716 Data Sheet

Dual-Core Intel

® 

Xeon

® 

Processor 5100 Series Datasheet

77

1.

These values are specified at V

CC_MAX

 for all processor frequencies. Systems must be designed to ensure 

the processor is not to be subjected to any static V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

CC_MAX

 at 

specified I

CC

. Please refer to the loadline specifications in 

.

2.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 

maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

3.

These specifications are based pre-silicon estimates and simulations. These specifications will be updated 

with characterized data from silicon measurements in a future release of this document.

4.

Power specifications are defined at all VIDs found in 

.

5.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor 

frequency requirements

1.

The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not 

require NEBS Level 3 compliance. Please refer to 

 for discrete points that constitute the thermal 

profile.

2.

The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating 

temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances 

per year, as compliant with NEBS Level 3. Please refer to 

 for discrete points that constitute the 

thermal profile.

3.

Implementation of either thermal profile should result in virtually no TCC activation. (See 

 for 

details on TCC activation).

4.

Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the 

Short-Term Thermal Profile for a duration longer than the limits specified in Note 2 above, do not meet the 

processor’s thermal specifications and may result in permanent damage to the processor.

5.

Refer to the Dual-Core Intel® Xeon® Processor LV 5138 in Embedded Applications Thermal/Mechanical 

Design Guideline for system and environmental implementation details.

5138

35

5

See 

; 

1, 2, 3, 4, 5