Intel Quad-core Intel Xeon DP L5320 Passive BX80563L5320P Data Sheet

18

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

For clean on-chip processor core power distribution, the processor has 223 V

CC

 (power) 

and 267 V

SS

 

(ground) inputs. All V

CC

 lands must be connected to the processor power 

plane, while all V

SS

 lands must be connected to the system ground plane. The 

processor V

CC

 lands must be supplied with the voltage determined by the processor 

Voltage IDentification (VID) signals. See 

 for VID definitions.

Twenty two lands are specified as V

TT

, which provide termination for the FSB and 

provides power to the I/O buffers. The platform must implement a separate supply for 
these lands which meets the V

TT

 specifications outlined in 

Due to its large number of transistors and high internal clock speeds, the processor is 
capable of generating large average current swings between low and full power states. 
This may cause voltages on power planes to sag below their minimum values if bulk 
decoupling is not adequate. Larger bulk storage (C

BULK

), such as electrolytic capacitors, 

supply current during longer lasting changes in current demand by the component, 
such as coming out of an idle condition. Similarly, they act as a storage well for current 
when entering an idle condition from a running condition. Care must be taken in the 
baseboard design to ensure that the voltage provided to the processor remains within 
the specifications listed in 

. Failure to do so can result in timing violations or 

reduced lifetime of the component. For further information and guidelines, refer to the 
appropriate platform design guidelines.

Vcc regulator solutions need to provide bulk capacitance with a low Effective Series 
Resistance (ESR), and the baseboard designer must assure a low interconnect 
resistance from the regulator (EVRD or VRM pins) to the LGA771 socket. Bulk 
decoupling must be provided on the baseboard to handle large current swings. The 
power delivery solution must insure the voltage and current specifications are met (as 
defined in 

). For further information regarding power delivery, decoupling 

and layout guidelines, refer to the appropriate platform design guidelines.

Bulk decoupling must be provided on the baseboard. Decoupling solutions must be 
sized to meet the expected load. To insure optimal performance, various factors 
associated with the power delivery solution must be considered including regulator 
type, power plane and trace sizing, and component placement. A conservative 
decoupling solution consists of a combination of low ESR bulk capacitors and high 
frequency ceramic capacitors. For further information regarding power delivery, 
decoupling and layout guidelines, refer to the appropriate platform design guidelines.