Intel Quad-core Intel Xeon DP L5320 Passive BX80563L5320P Data Sheet

Product codes

BX80563L5320P

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

Mechanical Specifications

The Quad-Core Intel® Xeon® Processor 5300 Series are packaged in a Flip Chip Land
Grid Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket.
The package consists of two processor dies mounted on a pinless substrate with 771
lands. An integrated heat spreader (IHS) is attached to the package substrate and core
and serves as the interface for processor component thermal solutions such as a
heatsink.

Figure 3-1

shows a sketch of the processor package components and how

they are assembled together. Refer to the LGA771 Socket Design Guidelines for
complete details on the LGA771 socket.

The package components shown in

Figure 3-1

include the following:

• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor Die
• Package Substrate
• Landside capacitors
• Package Lands

Note:

This drawing is not to scale and is for reference only.

3.1

Package Mechanical Drawings

The package mechanical drawings are shown in

Figure 3-2

through

Figure 3-4

. The

drawings include dimensions necessary to design a thermal solution for the processor
including:

• Package reference and tolerance dimensions (total height, length, width, and so

forth)

• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keepout dimensions
• Reference datums

Note:

All drawing dimensions are in mm [in.].

Figure 3-1. Processor Package Assembly Sketch

IHS

Substrate

LGA771 Socket

System Board

Capacitors

Core (die)

TIM

Package Lands