Intel Xeon 5120 1.86 GHz 124724 Data Sheet
Product codes
124724
Thermal Specifications
80
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements
6.
These values only apply to the B-step of the Dual-Core Intel® Xeon® Processor 5160. For the G-step
specifications, please refer to
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to
for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
for details on TCC activation).
3.
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to
for
discrete points that constitute the thermal profile.
4.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor’s thermal specifications and may result in permanent damage to the processor.
5.
Refer to the Dual-Core Intel
®
Xeon
®
Processor 5100 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
6.
This Thermal Profile apply to the B-step of the Dual-Core Intel® Xeon® Processor 5160 only.
Figure 6-4.Dual-Core Intel® Xeon® Processor 5160 Thermal Profiles A and B
TCASE_MAX_B@TDP is a thermal solution design point. In actuality, units will
not significantly exceed TCASE_MAX_A due to TCC activation.
not significantly exceed TCASE_MAX_A due to TCC activation.
TCASE_MAX_B@TDP
TCASE_MAX_A@TDP
Thermal Profile B
Y = 0.282*x +42.4
Y = 0.282*x +42.4
Thermal Profile A
Y = 0.231*x +41.5
Y = 0.231*x +41.5
40
45
50
55
60
65
70
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
Power [W]
T
e
m
p
er
at
u
re [
C
]
TCASE_MAX_B@TDP is a thermal solution design point. In actuality, units will
not significantly exceed TCASE_MAX_A due to TCC activation.
not significantly exceed TCASE_MAX_A due to TCC activation.
TCASE_MAX_B@TDP
TCASE_MAX_A@TDP
Thermal Profile B
Y = 0.282*x +42.4
Y = 0.282*x +42.4
Thermal Profile A
Y = 0.231*x +41.5
Y = 0.231*x +41.5
40
45
50
55
60
65
70
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
Power [W]
T
e
m
p
er
at
u
re [
C
]
Table 6-9.
Dual-Core Intel® Xeon® Processor 5160 Thermal Profile A Table (Sheet 1 of
2)
Power (W)
T
CASE_MAX
(°C)
P
_PROFILE_MIN_A
=36.8
50.0
40
50.7
45
51.9
50
53.1
55
54.2
60
55.4
65
56.5