Intel Pentium D 945 HH80553PG0964MN User Manual

Product codes
HH80553PG0964MN
Page of 112
Datasheet
13
Introduction
• Intel
®
 975X Express chipset — Chipset that supports DDR2 memory technology 
for the processor.
• Processor core — Processor core die with integrated L2 cache. 
• LGA775 socket — The processor mates with the system board through a surface 
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used 
to enhance the thermal performance of the package. Component thermal solutions 
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any 
mechanical features for heatsink attach, a retention mechanism is required. 
Component thermal solutions should attach to the processor via a retention 
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to 
the chipset. Also referred to as the processor system bus or the system bus. All 
memory and I/O transactions as well as interrupt messages pass between the 
processor and chipset over the FSB.
• Storage conditions — Refers to a non-operational state. The processor may be 
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or 
exposed to free air. Under these conditions, processor lands should not be 
connected to any supply voltages, have any I/Os biased, or receive any clocks. 
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from 
packaging material), the processor must be handled in accordance with moisture 
sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation — Refers to normal operating conditions in which all 
processor specifications, including DC, AC, system bus, signal quality, mechanical 
and thermal are satisfied. 
1.2
References
Material and concepts available in the following documents may be beneficial when 
reading this document.
Table 1.
References
Document
Location
Intel
®
 Pentium
®
 D Processor 900 Sequence and Intel
®
 Pentium
®
 
Processor Extreme Edition 955, 965 Specification Update
http://www.intel.com/
design/pentiumXE/
specupdt/310307.htm
Intel
®
 Pentium
®
 D Processor, Intel
®
 Pentium
®
 Processor Extreme 
Edition, and Intel
®
 Pentium
®
 4 Processor Thermal and Mechanical 
Design Guidelines
http://www.intel.com/
design/pentiumXE/
designex/306830.htm 
Voltage Regulator-Down (VRD) 10.1 Design Guide For Desktop and 
Transportable LGA775 Socket
http://intel.com/design/
Pentium4/guides/
302356.htm
Intel
®
 Virtualization Technology Specification for the IA-32 Intel
®
 
Architecture
http://www.intel.com/
technology/computing/
vptech/index.htm
LGA775 Socket Mechanical Design Guide
http://intel.com/design/
Pentium4/guides/
302666.htm
Balanced Technology Extended (BTX) System Design Guide
www.formfactors.org