Intel Pentium D 945 HH80553PG0964MN User Manual

37

The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that 

interfaces with the motherboard via an LGA775 socket. The package consists of a 

processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS) 

is attached to the package substrate and core and serves as the mating surface for 

processor component thermal solutions, such as a heatsink. 

 shows a sketch of 

the processor package components and how they are assembled together. Refer to the 

LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.

The package components shown in 

 include the following:

• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors

NOTE:
1.

Socket and motherboard are included for reference and are not part of processor package.

The package mechanical drawings are shown in 

 and 

. The 

drawings include dimensions necessary to design a thermal solution for the processor. 

These dimensions include:

• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm [in]. 
• Guidelines on potential IHS flatness variation with socket load plate actuation and 

installation of the cooling solution is available in the processor Thermal/Mechanical 

Design Guidelines.

System Board

LGA775 Socket

Capacitors

TIM

Core (die)

IHS

Substrate