Intel PentiumD 950 HH80553PG0964M User Manual

Product codes
HH80553PG0964M
Page of 112
Datasheet
107
Balanced Technology Extended (BTX) Boxed Processor Specifications
8.3
Thermal Specifications
This section describes the cooling requirements of the thermal module assembly 
solution used by the boxed processor.
8.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a TMA. However, meeting the 
processor's temperature specification is also a function of the thermal design of the 
entire system, and ultimately the responsibility of the system integrator. The processor 
case temperature specification is in 
. The boxed processor TMA is able to 
keep the processor temperature within the specifications in 
 for chassis that 
provide good thermal management. For the boxed processor TMA to operate properly, 
it is critical that the airflow provided to the TMA is unimpeded. Airflow of the TMA is into 
the duct and out of the rear of the duct in a linear flow. Blocking the airflow to the TMA 
inlet reduces the cooling efficiency and decreases fan life. Filters will reduce or impede 
airflow which will result in a reduced performance of the TMA. The air temperature 
entering the fan should be kept below 35.5°C. Again, meeting the processor's 
temperature specification is the responsibility of the system integrator. 
Figure 31.
Balanced Technology Extended (BTX) Mainboard Power Header Placement 
(Hatched Area)