Intel PentiumD 950 HH80553PG0964M User Manual

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This section describes the cooling requirements of the fan heatsink solution used by the 

boxed processor.

The boxed processor may be directly cooled with a fan heatsink. However, meeting the 

processor's temperature specification is also a function of the thermal design of the 

entire system, and ultimately the responsibility of the system integrator. The processor 

temperature specification is found in 

 of this document. The boxed processor 

fan heatsink is able to keep the processor temperature within the specifications (see 

) in chassis that provide good thermal management. For the boxed processor 

fan heatsink to operate properly, it is critical that the airflow provided to the fan 

heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the 

sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow 

through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink 

reduces the cooling efficiency and decreases fan life. 

 illustrate 

an acceptable airspace clearance for the fan heatsink. The air temperature entering the 

fan should be kept below 38 °C. A Thermally Advantaged Chassis with an Air Guide 1.1 

is recommended to meet the 38 °C requirement. Again, meeting the processor's 

temperature specification is the responsibility of the system integrator. 

The processor fan is the primary source of airflow for cooling the Vcc voltage regulator. 

Dedicated voltage regulator cooling components may be necessary if the selected fan is 

not capable of keeping regulator components below maximum rated temperatures.

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