Intel X3460 BV80605001908AL User Manual
Product codes
BV80605001908AL
Electrical Specifications
74
Datasheet, Volume 1
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
V
IL
is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
3.
V
IH
is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value.
4.
V
IH
and V
OH
may experience excursions above V
DDQ
. However, input signal drivers must comply with the signal quality
specifications.
5.
This is the pull down driver resistance.
6.
R
VTT_TERM
is the termination on the DIMM and is not controlled by the processor.
7.
COMP resistance must be provided on the system board with 1% resistors. COMP resistors are to V
SS
.
Table 7-8.
DDR3 Signal Group DC Specifications
Symbol
Parameter
Alpha
Group
Min
Typ
Max
Units
Notes
1
V
IL
Input Low Voltage
(e,f)
—
—
0.43*V
DDQ
V
2,4
V
IH
Input High Voltage
(e,f)
0.57*V
DDQ
—
—
V
3
V
OL
Output Low Voltage
(c,d,e,f)
—
(V
DDQ
/ 2)* (R
ON
/
(R
ON
+R
VTT_TERM
))
—
6
V
OH
Output High Voltage
(c,d,e,f)
—
V
DDQ
– ((V
DDQ
/ 2)*
(R
ON
/(R
ON
+R
VTT_TERM
))
—
V
4,6
R
ON
DDR3 Clock Buffer On
Resistance
—
21
—
36
5
R
ON
DDR3 Command Buffer On
Resistance
—
20
—
31
5
R
ON
DDR3 Control Buffer On
Resistance
—
20
—
31
5
R
ON
DDR3 Data Buffer On
Resistance
—
21
—
36
5
Data ODT
On-Die Termination for
Data Signals
(d)
93.5
—
126.5
I
LI
Input Leakage Current
—
—
—
± 1
mA
SM_RCOMP0
COMP Resistance
(t)
99
100
101
7
SM_RCOMP1
COMP Resistance
(t)
24.7
24.9
25.1
7
SM_RCOMP2
COMP Resistance
(t)
128.7
130
131.3
7