Intel S1400SP4 DBS1400SP4 User Manual
Product codes
DBS1400SP4
Environmental Limits Specification
Intel® Server Board S1400SP TPS
Revision 1.0
Intel order number G64248-001
100
11. Environmental Limits Specification
The following table defines the Intel
®
Server Board S1400SP operating and non-operating
environmental limits. Operation of the Intel
®
Server Board S1400SP at conditions beyond those
shown in the following table may cause permanent damage to the system. Exposure to absolute
maximum rating conditions for extended periods may affect system reliability.
maximum rating conditions for extended periods may affect system reliability.
Table 51. Server Board Design Specifications
Operating Temperature
0ºC to 55ºC
1
(32ºF to 131ºF)
Non-Operating Temperature
-40ºC to 70ºC (-40ºF to 158ºF)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
, 170 inches/sec
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note:
1.
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel
components that need adequate airflow to cool. Intel
®
ensures through its own chassis
development and testing that when Intel
®
server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel
responsibility of the system integrator who chooses not to use Intel
®
developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of airflow
required for their specific application and environmental conditions. Intel Corporation cannot be
held responsible, if components fail or the server board does not operate correctly when used
outside any of its published operating or non-operating limits.
required for their specific application and environmental conditions. Intel Corporation cannot be
held responsible, if components fail or the server board does not operate correctly when used
outside any of its published operating or non-operating limits.
Disclaimer Note: Intel
®
ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
11.1 Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel
®
processor-based systems, the
processor must remain within the defined minimum and maximum case temperature (T
CASE
)
specifications. Thermal solutions not designed to provide sufficient thermal capability may affect
the long-term reliability of the processor and system. The server board is designed to support
the Intel
the long-term reliability of the processor and system. The server board is designed to support
the Intel
®
Xeon
®
Processor E5-2400 product family TDP guidelines up to and including 95W.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel
power delivery components that need adequate airflow to cool. Intel
®
ensures through its own
chassis development and testing that when Intel
®
server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel
the responsibility of the system integrator who chooses not to use Intel
®
developed server