Intel L5508 AT80602002697AC Data Sheet
Product codes
AT80602002697AC
81
Thermal Specifications
power dissipation is currently planned. Intel® Thermal Monitor 1 and Intel®
Thermal Monitor 2 feature must be enabled for the processor to remain within
its specifications.
Thermal Monitor 2 feature must be enabled for the processor to remain within
its specifications.
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
2.
Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on silicon characterization.
4.
Power specifications are defined at all VIDs found in
. The Quad-Core Intel® Xeon® Processor
X5482 may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
6.
The Quad-Core Intel® Xeon® Processor X5482 is intended for dual processor workstations only.
Notes:
1.
for discrete points that constitute the thermal profile.
2.
Implementation of the Quad-Core Intel® Xeon® Processor X5482 Thermal Profile should result in virtually
no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor Thermal
Profile will result in increased probability of TCC activation and may incur measurable performance loss.
3.
Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines
(TMDG) for system and environmental implementation details.
Table 6-1.
Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step) Thermal
Specifications
Core
Frequency
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
150 (X5492 and
X5482 C-step)
5
1,2,3,4,5,6
Figure 6-1. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step)Thermal Profile
Thermal Profile (2U)
35
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Pow e r [W]
T
case
[
C
]
Thermal Profile
Y = 0.187*x + 35
Y = 0.187*x + 35
Thermal Profile (2U)
35
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Pow e r [W]
T
case
[
C
]
Thermal Profile
Y = 0.187*x + 35
Y = 0.187*x + 35