Intel E3-1275L v3 CM8064601575224 User Manual

Intel

Product codes

CM8064601575224

6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 85

7.0 Electrical Specifications.............................................................................................. 86

7.1 Integrated Voltage Regulator..................................................................................86
7.2 Power and Ground Lands ...................................................................................... 86
7.3 V

Voltage Identification (VID).............................................................................. 86

7.4 Reserved or Unused Signals................................................................................... 91
7.5 Signal Groups.......................................................................................................91
7.6 Test Access Port (TAP) Connection.......................................................................... 93
7.7 DC Specifications................................................................................................. 93
7.8 Voltage and Current Specifications.......................................................................... 94

7.8.1 PECI DC Characteristics............................................................................. 99
7.8.2 Input Device Hysteresis........................................................................... 100

8.0 Package Mechanical Specifications........................................................................... 101

8.1 Processor Component Keep-Out Zone.................................................................... 101
8.2 Package Loading Specifications............................................................................. 101
8.3 Package Handling Guidelines................................................................................ 102
8.4 Package Insertion Specifications............................................................................102
8.5 Processor Mass Specification.................................................................................102
8.6 Processor Materials............................................................................................. 102
8.7 Processor Markings............................................................................................. 103
8.8 Processor Land Coordinates..................................................................................103
8.9 Processor Storage Specifications........................................................................... 104

9.0 Processor Ball and Signal Information...................................................................... 106

Figures

Platform Block Diagram ........................................................................................... 10

Flex Memory Technology Operations................................................................. 20

PCI Express* Related Register Structures in the Processor............................................ 24

PCI Express* Typical Operation 16 Lanes Mapping....................................................... 25

Processor Graphics Controller Unit Block Diagram........................................................ 28

Processor Display Architecture...................................................................................31

DisplayPort* Overview............................................................................................. 32

HDMI* Overview..................................................................................................... 33

Example for PECI Host-Clients Connection.................................................................. 37

Device to Domain Mapping Structures........................................................................ 41

Processor Power States............................................................................................ 48

Idle Power Management Breakdown of the Processor Cores ..........................................51

Thread and Core C-State Entry and Exit......................................................................52

Package C-State Entry and Exit................................................................................. 56

Thermal Test Vehicle (TTV) Case Temperature (T

) Measurement Location..................64

Digital Thermal Sensor (DTS) 1.1 Definition Points....................................................... 65

Digital Thermal Sensor (DTS) Thermal Profile Definition................................................67

Package Power Control............................................................................................. 75

Input Device Hysteresis.......................................................................................... 100

Processor Package Assembly Sketch.........................................................................101

Processor Top-Side Markings................................................................................... 103

Processor Package Land Coordinates........................................................................ 104

Contents—Processor

Intel

®

Xeon

®

Processor E3-1200 v3 Product Family

June 2013

Datasheet – Volume 1 of 2

Order No.: 328907-001

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