Fujifilm Xeon 5050 S26361-F3248-L300 Data Sheet

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 

3

Introduction.................................................................................................................9
1.1

Terminology ..................................................................................................... 11

Electrical Specifications ............................................................................................... 15
2.1

Front Side Bus and GTLREF ................................................................................ 15

Power and Ground Lands.................................................................................... 15

Decoupling Guidelines........................................................................................ 16
2.3.1

 

Decoupling...................................................................................... 16

Decoupling ...................................................................................... 16

Front Side Bus AGTL+ Decoupling ............................................................ 16

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 16
2.4.1

Voltage Identification (VID) ................................................................................ 19

Reserved or Unused Signals................................................................................ 21

Front Side Bus Signal Groups.............................................................................. 21

GTL+ Asynchronous and AGTL+ Asynchronous Signals ........................................... 23

Test Access Port (TAP) Connection....................................................................... 23

2.10 Mixing Processors.............................................................................................. 24
2.11 Absolute Maximum and Minimum Ratings ............................................................. 24
2.12 Processor DC Specifications ................................................................................ 25

Mechanical Specifications............................................................................................. 33
3.1

 Signal Definitions ...................................................................................................... 61
5.1

Thermal Specifications ................................................................................................ 69
6.1

Package Thermal Specifications........................................................................... 69
6.1.1

Thermal Specifications ............................................................................ 69