Fujifilm Xeon 5050 S26361-F3248-L300 Data Sheet
Product codes
S26361-F3248-L300
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
75
Thermal Specifications
Notes:
1.
Thermal Profile is representative of a volumetrically constrained platform. Please refer to
for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet Thermal Profile will not meet the processor’s thermal specifications and
may result in permanent damage to the processor.
3.
Refer to the Dual-Core Intel
®
Xeon
®
Processor 5000 Series Thermal/Mechanical Design Guidelines for
system and environment implementation details.
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (T
CASE
) specified in
,
processor integrated heat spreader (IHS).
illustrates the location where
Figure 6-3. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile
Thermal Profile
40
45
50
55
60
65
70
0
10
20
30
40
50
60
70
80
90
100
Pow e r [W]
T
c
as
e [
C
]
Thermal Profile
Y = 0.260*x + 42.3
Y = 0.260*x + 42.3
TCASE_MAX@TDP
Thermal Profile
40
45
50
55
60
65
70
0
10
20
30
40
50
60
70
80
90
100
Pow e r [W]
T
c
as
e [
C
]
Thermal Profile
Y = 0.260*x + 42.3
Y = 0.260*x + 42.3
TCASE_MAX@TDP
Table 6-8.
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table
Power (W)
T
CASE_MAX
(
°
C)
Power (W)
T
CASE_MAX
(
°
C)
P_profile_min
_B
=29.6
50.0
75
61.8
35
51.4
80
63.1
40
52.7
85
64.4
45
54.0
90
65.7
50
55.3
95
67.0
55
56.6
60
57.9
65
59.2
70
60.5