Fujifilm Xeon 5050 S26361-F3248-L300 Data Sheet

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

91

The boxed processor will be shipped with an unattached thermal solution. Clearance is 
required around the thermal solution to ensure unimpeded airflow for proper cooling. 
The physical space requirements and dimensions for the boxed processor and 
assembled heat sink are shown in 

. 

 through 

 are the mechanical drawings for the 4-pin board fan header and 4-pin 

connector used for the active CEK fan heat sink solution.