Intel Pentium 4 641 HH80552PG0882M User Manual
Product codes
HH80552PG0882M
38
Datasheet
Package Mechanical Specifications
3.1.5
Package Insertion Specifications
The Pentium 4 processor in the 775-land package can be inserted into and removed from a
LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the
LGA775 Socket Mechanical Design Guide.
LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the
LGA775 Socket Mechanical Design Guide.
3.1.6
Processor Mass Specification
The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass
[weight] includes all the components that are included in the package.
[weight] includes all the components that are included in the package.
3.1.7
Processor Materials
lists some of the package components and associated materials.
3.1.8
Processor Markings
identification of the Pentium 4 processor in the 775-land package.
Table 3-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Figure 3-5. Processor Top-Side Markings
ATPO
S/N
S/N
INTEL
m
© ‘04
Pentium® 4
3.60GHZ/1M/800/04B
SLxxx [COO]
[FPO]
3.60GHZ/1M/800/04B
SLxxx [COO]
[FPO]