Intel Pentium 4 641 HH80552PG0882M User Manual

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The Pentium 4 processor on 90 nm process in the 775-land package will also be offered as an Intel 
boxed processor. Intel boxed processors are intended for system integrators who build systems 
from baseboards and standard components. The boxed Pentium 4 processor in the 775-land 
package will be supplied with a cooling solution. This chapter documents baseboard and system 
requirements for the cooling solution that will be supplied with the boxed Pentium 4 processor in 
the 775-land package. This chapter is particularly important for OEMs that manufacture 
baseboards for system integrators. Unless otherwise noted, all figures in this chapter are 
dimensioned in millimeters and inches [in brackets]. 

 shows a mechanical representation 

of a boxed Pentium 4 processor in the 775-land package.

Drawings in this section reflect only the specifications on the Intel boxed processor product. These 
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system 
designers’ responsibility to consider their proprietary cooling solution when designing to the 
required keep-out zone on their system platforms and chassis. Refer to the Intel

Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for further 
guidance. Contact your local Intel Sales Representative for this document.

 

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.