Preci Dip IC socket 15.24 mm Number of pins: 50 110-83-650-41-001101 Precision contacts 1 pc(s) 110-83-650-41-001101 Data Sheet

Due to technical progress, all information provided is subject to change without prior notice.

The values listed below are general specs applying for Preci-Dip DIL sockets. Please see individual catalog page for additional and product

specific technical data.

-55 ... +125 °C

55/125/21

Annual mean 75%

 100 

V

RMS

/150 V

DC

Preci-Dip sockets are recognized by Underwriters Laboratories Inc. and listed under “Connectors for Use in Data, Signal, Control and 

Power Applications“, File Nr. E174442.

•  Standard packaging for DIL sockets is tube

packaging.

•  SMD mount sockets available on request

with Tape & Reel packaging acc. to EIA Standard 481.

These products are marked with the symbol:

Please consult 

www.precidip.com for availability,

size of tape, size of reel, number of components

per reel and packing units.

Min. 40 N (no displacement under axial force applied)

Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2

Min. 10’000 M

Ω

Max. 1 pF

Min. 0.6 mm

The sockets withstand the following environmental tests without mechanical

and electrical defects:

• Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C,  16 h

•  Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH,

1 cycle of 24 h

• Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h

• Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min.

•  Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g,

1 octave/min, 10 cycles for each axis

• Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis

During the above two tests, no contact interruption >50 ns does appear.

• Solderability J-STD-002A, Test A, 245 °C, 5 s, solder alloy SnAg3.8Cu0.7

• Resistance to soldering heat J-STD-020C, 260 °C, 20 s

• Moisture sensitivity J-STD-020C level 1

• Resistance to corrosion:

   

1) Salt spray test IEC 60068-2-11.Ka: 48 h

   

2)  Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2,

25 °C, 75 %rH

   

3)  Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S,

25 °C, 75 %rH

• Press-in force:  

90 N max. (at min. hole dia.) / 65 N typ.

• Push-out force: 

30 N min. (at max. hole dia.) / 50 N typ.

• Push-out 3rd cycle: 

20 N min. (at max. hole dia.)

• 2.54 mm grid  

 Finished hole Ø: 1 + 0.09/-0.06 mm

Drilled hole Ø: 1.15 ± 0.025 mm

PCB surface finish 

Hole plating

• Tin 

5-15 μm tin over min. 25 μm copper

• Copper 

min. 25 μm copper

• Gold over nickel 

 0.05-0.2 μm gold over 2.5-5 μm nickel

over min. 25 μm copper