Intel Xeon 3.20GHz Processor RK80546KG0882MM User Manual

 

 

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A retention system needs to isolate any load in excess of 222.41 N, compressive, from the socket 
during the shock and vibration conditions outlined in 

. The socket must pass the 

mechanical shock and vibration requirements listed in 

 with the associated heatsink and 

retention mechanism attached. Socket can only be attached by the 603 contacts to the motherboard. 
No external (i.e. screw, extra solder, adhesive....) methods to attach the socket are acceptable. 

Thermoplastic or equivalent, UL 94V-0 flame rating, temperature rating and design capable of 
withstanding a temperature of 240°C for 40sec (minimum) typical of a reflow profile for solder 
material used on the socket. The material must have a thermal coefficient of expansion in the XY 
plane capable of passing reliability tests rated for an expected high operating temperature, mounted 
on FR4type motherboard material. 

The color of the socket can be optimized to provide the contrast needed for OEM’s pick and place 
vision systems. The base and cover of the socket may be different colors as long as they meet the 
above requirement. 

Recessed cutouts are required in the side of the socket to provide better access to the package 
substrate, and facilitate the manual removal of inserted package (see 

).

Socket stand off height, cover lead in and cover lead in depth must not interfere with package pin 
shoulder at worst-case conditions. The processor (not the pin shoulder) must sit flush on the socket 
standoffs and the pin field cannot contact the standoffs (see