AMD Sempron 3800+ SDA3800IAA3CN Product Datasheet

Product codes

SDA3800IAA3CN

31805

Rev. 3.05

September 2006

AMD Sempron™ Processor Product Data Sheet

939-Pin Package Specific Features

•

Refer to the AMD Functional Data Sheet,
939-Pin Package, order# 31411, for functional,
electrical, and mechanical details of 939-pin
package processors

•

Packaging
–

939-pin lidded micro PGA

–

1.27-mm pin pitch

–

31x31-row pin array

–

40mm x 40mm organic substrate

–

Organic C4 die attach

•

Integrated Memory Controller
–

Low-latency, high-bandwidth

–

144-bit DDR SDRAM at 100, 133, 166, and
200 MHz

–

Supports up to four unbuffered DIMMs

–

ECC checking with double-bit detect and single-bit
correct

•

Electrical Interfaces
–

HyperTransport™ technology: LVDS-like
differential, unidirectional

–

DDR SDRAM: SSTL_2 per JEDEC specification

–

Clock, reset, and test signals also use DDR
SDRAM-like electrical specifications

Socket AM2 Processor Specific
Features

•

Refer to the Socket AM2 Processor Functional
Data Sheet, order# 31117, for functional and
mechanical details of socket AM2 processors.
Refer to the AMD NPT Family 0Fh Processor
Electrical Data Sheet, order# 31119, for
electrical details of socket AM2 processors.

•

Packaging
–

Lidded micro PGA

–

1.27-mm pin pitch

–

31x31 grid array

–

Compliant with RoHS (EU Directive 2002/95/EC)
with lead used only in small amounts in specifically
exempted applications

•

Integrated Memory Controller
–

Low-latency, high-bandwidth

–

128-bit DDR2 SDRAM controller operating at up
to 333 MHz

–

Supports up to four unbuffered DIMMs

•

Electrical Interfaces
–

HyperTransport™ technology: LVDS-like
differential, unidirectional

–

DDR2 SDRAM: SSTL_1.8 per JEDEC
specification

–

Clock, reset, and test signals also use DDR2
SDRAM-like electrical specifications