Intel Quad-core Intel Xeon DP X5335 Passive BX80563X5335P Data Sheet
Product codes
BX80563X5335P
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
91
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
.
2.
Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
CASE
.
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
4.
These specifications are based on silicon characterization.
5.
Power specifications are defined at all VIDs found in
. The Quad-Core Intel® Xeon® Processor
X5300 Series may be shipped under multiple VIDs for each frequency.
6.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A is representative of a volumetrically
unconstrained platform. Please refer to
for discrete points that constitute the thermal profile.
2.
Implementation of Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet processor Quad-
Core Intel® Xeon® Processor X5300 Series Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (See
for details on TCC activation).
3.
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B is representative of a volumetrically
constrained platform. Please refer to
for discrete points that constitute the thermal profile.
4.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor's thermal specifications and may result in permanent damage to the processor.
5.
Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Table 6-3.
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Specifications
Core
Frequency
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
145
120
5
1, 2, 3, 4, 5, 6
Figure 6-2.Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profiles
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
Pow e r [W]
T
case
[
C
]
Thermal Profile B
Y = 0.224*x + 43.1
Y = 0.224*x + 43.1
Thermal Profile A
Y = 0.171*x + 42.5
Y = 0.171*x + 42.5
TCASE_MAX is a thermal solution design point.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
Pow e r [W]
T
case
[
C
]
Thermal Profile B
Y = 0.224*x + 43.1
Y = 0.224*x + 43.1
Thermal Profile A
Y = 0.171*x + 42.5
Y = 0.171*x + 42.5
TCASE_MAX is a thermal solution design point.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.